JPS60201622A - 半導体ウエ−ハの保護膜の自動打抜き装置 - Google Patents
半導体ウエ−ハの保護膜の自動打抜き装置Info
- Publication number
- JPS60201622A JPS60201622A JP59057954A JP5795484A JPS60201622A JP S60201622 A JPS60201622 A JP S60201622A JP 59057954 A JP59057954 A JP 59057954A JP 5795484 A JP5795484 A JP 5795484A JP S60201622 A JPS60201622 A JP S60201622A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cylinder
- piston rod
- protective film
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000004080 punching Methods 0.000 title claims abstract description 27
- 230000001681 protective effect Effects 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 13
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 4
- 229920002554 vinyl polymer Polymers 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 2
- 230000006378 damage Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920006266 Vinyl film Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59057954A JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59057954A JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201622A true JPS60201622A (ja) | 1985-10-12 |
| JPH0121622B2 JPH0121622B2 (en]) | 1989-04-21 |
Family
ID=13070418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59057954A Granted JPS60201622A (ja) | 1984-03-26 | 1984-03-26 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201622A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02134038U (en]) * | 1989-04-12 | 1990-11-07 |
-
1984
- 1984-03-26 JP JP59057954A patent/JPS60201622A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0121622B2 (en]) | 1989-04-21 |
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